SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve a reliability by eliminating an improper connection between solder balls and lands. SOLUTION: The semiconductor device includes a tape substrate 1 having vias 21 made therein, a TAB(tape automated bonding) tape having at least lands 7 arranged on the vias 21, a semic...

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Bibliographische Detailangaben
Hauptverfasser:	KISHI HIROAKI, NEGISHI TOKUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve a reliability by eliminating an improper connection between solder balls and lands. SOLUTION: The semiconductor device includes a tape substrate 1 having vias 21 made therein, a TAB(tape automated bonding) tape having at least lands 7 arranged on the vias 21, a semiconductor chip 5 connected at electrodes through bonding wires 19 to bonding pads 3 electrically connected via the lands 7 and wring lines 13, and solder balls 15 formed on a side of the tape substrate 15 opposed to the lands 7 as contacted with the lands 7 through the vias 21. In this case, the lands 7 are provided as projected toward the solder balls 15.