ADHESIVE FILM FOR SEMICONDUCTOR AND LEAD FRAME PREPARED BY USING SAME

PROBLEM TO BE SOLVED: To obtain an adhesive film for semiconductors which does not produce cutting burrs and cutting scraps in its punching work and exhibits improved productivity and quality by bonding an insulation film to an adhesive layer so that the peeling strength is a specified value or lower. SOLUTION: This adhesive film for semiconductors comprises an insulation film and an adhesive layer bonded to at least one side thereof and is punched with a punch or die to be used for semiconductors of a COL structure or an LOC structure. The peel strength at room temp. is set at 600 g/cm or lower. An adhesive film 21 comprises a polyimide insulation film 22 and an adhesive layer 23 comprising a thermoplastic or thermosetting adhesive and formed on both sides of the insulation film 22, the peeling strength of the insulation film 22 from the adhesive layer 23 being specified. In order to improve the adhesive properties, both sides of the insulating film 22 are subjected to a surface treatment, e.g. to a common plasma treatment or a corona discharge treatment under adjusted conditions for an adjusted time.