CIRCUIT COMPONENT AND PRODUCTION THEREOF

PROBLEM TO BE SOLVED: To produce a compact and high density circuit component provided with at least one of either an inductor and a capacitor by applying on the outer surface of a core substrate the so-called 'build-up' processing consisting of an insulating resin coating process, a conductor plating process and a conductor pattern etching process. SOLUTION: While a substrate with a wiring pattern 1 is used for element connection as a core substrate 2, insulating layers a1-a8, a conductor layer and a via hole 3 are formed on the outer surface of the core substrate 2 by a build-up processing for alternately laminating the insulating layers and the conductor layer, an outer layer circuit provided with the inductor and capacitor is formed by the insulating layers a1-a8, the conductor layer and the via hole 3, and terminals f1-f3 for external connection are formed on the outer surface of the outer layer circuit formed on the side of a component mounting surface, while using the same processes.