WIRING BOARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board, whereby a high-density and high-performance wiring can be formed and the productivity is good enough to suit to the mass production. SOLUTION: The method of manufacturing a wiring board 180 with the formed wiring 130 is such...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ASAKA KENJI, YOSHINUMA HIROTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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