WIRING BOARD AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board, whereby a high-density and high-performance wiring can be formed and the productivity is good enough to suit to the mass production. SOLUTION: The method of manufacturing a wiring board 180 with the formed wiring 130 is such...

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Bibliographische Detailangaben
Hauptverfasser:	ASAKA KENJI, YOSHINUMA HIROTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board, whereby a high-density and high-performance wiring can be formed and the productivity is good enough to suit to the mass production. SOLUTION: The method of manufacturing a wiring board 180 with the formed wiring 130 is such that, using one or a plurality of transferring original plates 101 having wirings composed of conductive layers of specified shape on a support 110, each transferring original plate 101 is pressure-welded to one surface of a base board 160 for a wiring board, and the support 110 is peeled off to transfer the wiring of each transferring original plate 101 to the base board through an adhesive or viscous insulative resin layer 140 of a shape suited to the wiring of each transferring original plate 101. After transferring the wiring of the transferring original plate 101, the insulative resin layer 140 extruding from the wiring region is removed by the laser irradiation using the wiring as a mask.