OPTICAL SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an optical semiconductor device in which plated wirings are not damaged by the tightening of a transfer molding mold. SOLUTION: A pair of through-holes 6a and 6b are formed at positions on a board 1 which are covered with a light transmitting molding unit 4. Plated w...

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Bibliographische Detailangaben
1. Verfasser:	ISHIZAKI JUNZO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an optical semiconductor device in which plated wirings are not damaged by the tightening of a transfer molding mold. SOLUTION: A pair of through-holes 6a and 6b are formed at positions on a board 1 which are covered with a light transmitting molding unit 4. Plated wirings 2a and 2b are formed from the surface of the board 1 so as to reach the rear of the board 1 through the through-holes 6a and 6b. An optical device 3 is mounted on the plated wirings 2a in the recess 1a of the board 1 by die- bonding and connected to the plated wiring 2b by wire bonding with a gold wire 5. The light transmitting molding unit 4 is formed around the optical device 3 with light transmitting resin by transfer molding.