METAL MASK AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To obtain a metal mask having a recess space covering a protrusion on a printed surface of a printed matter with small unevenness of a thickness of a mask plate having printing pores for passing paste-like ink and small process strain. SOLUTION: The metal mask comprises a plate...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBAZAKI SHOJI, FURUICHI NAOYA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES PRINTING PLATES OR FOILS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a metal mask having a recess space covering a protrusion on a printed surface of a printed matter with small unevenness of a thickness of a mask plate having printing pores for passing paste-like ink and small process strain. SOLUTION: The metal mask comprises a plate-like mask plate 1 having printing pores 4 provided corresponding to a pattern to be printed with paste- like ink on a printing surface of a printed matter and a protrusion passing hole 2 provided corresponding to a protrusion provided on the printing surface of the matter, and a cover 5 formed in a container shape opened at a lower surface. An edge of a periphery of an opening of the cover 5 is fixed to a periphery of the hole 2 of the plate 1 to be mounted on the plate 1. Another cover 5 previously formed is mounted on the plate 1 to form a recess covering the hole 2, and hence an unevenness in a thickness and a process strain are scarcely formed at the plate 1 having the pores 4.