METHOD AND APPARATUS FOR MOLDING RESIN PART

PROBLEM TO BE SOLVED: To enhance molding accuracy by reducing the clearance of a place where a resin is easy to flow without damaging the combination properties of molds and limiting a resin outflow rate to suppress the generation of a fiber uneven phenomenon. SOLUTION: A part to be molded is charge...

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1. Verfasser: YAMAGISHI KENJIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To enhance molding accuracy by reducing the clearance of a place where a resin is easy to flow without damaging the combination properties of molds and limiting a resin outflow rate to suppress the generation of a fiber uneven phenomenon. SOLUTION: A part to be molded is charged in the cavity formed by a pair of molds 1, 2 and a pair of the molds 1, 2 are mated while shifted in the direction crossing the mating direction of the molds 1, 2 at a right angle to preliminarily reduce the clearances F, G of mating surfaces and the molds 1, 2 are heated to supply a molten resin in a state increased in the temp. of the molds to mold the same. Mutual contact inclined surfaces or inclined curved surfaces are formed in order to relatively shift the molds 1, 2 and a method for laterally shifting the molds by sliding, contact parts 4, 5 is also adapted.