SUBSTRATE MOUNTING PART AND ITS FITTING STRUCTURE

PROBLEM TO BE SOLVED: To provide a substrate mounting part and a structure for fitting the same, which enables the soldering strength between a lead terminal and a land portion to be prevented from reducing, even through the overall size of the land portion is not so much larger than that of the lea...

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Bibliographische Detailangaben
Hauptverfasser:	HIRAKI HIROSHI, MURASE YOSHIHARU, OKANO RENJIROU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate mounting part and a structure for fitting the same, which enables the soldering strength between a lead terminal and a land portion to be prevented from reducing, even through the overall size of the land portion is not so much larger than that of the lead terminal. SOLUTION: A structure for fitting a substrate mounting part has a part body containing an operating portion, lead terminals protruding outward from at least one of the sides and ends of the part body connected with the operating portion, and a printed wiring board 56 on which land portions 62 to which the ends of the lead terminals are soldered are formed. The tip end of the lead terminals is inclined toward the top surface of the land portion 62 to form an inclined portion 34a, and a wedged gap formed between the lower surface of the inclined portion 34a and the top surface of the land portion 62 is filled with the fillet of solder 60 to soldering.