LEAD FRAME HAVING HEAT SPREAD AND SEMICONDUCTOR PACKAGE USING THE SAME

PROBLEM TO BE SOLVED: To enable a chip of various sizes to be mounted on a lead frame of the same standards irrespective of the size of the chip, by fixing the top ends of inner leads between heat spreads having parts projecting to the edge located on the same plane as the inner lead top face, distant from the top ends of the inner leads. SOLUTION: A heat spread 3a having a projecting part 3-2 to the edge 3-1 located at the bottom of the top end of an inner lead 2 extending from an outer lead 1, so that the edge 3-1 is distant by specified distance from the top end of the inner lead 2 and the top face is located in the same plate as the top face of the inner lead. Semiconductor chips 4a, 4b mounted on the top face of the heat spread 3a are respectively electrically connected to bonding pads 5 formed on the semiconductor chips and inner leads 2 through conductive connection members 6. The heat spread 3a is fixed to the inner lead top end lower part through an insulation adhesive 7.