PATTERN FORMING DEVICE AND METHOD THEREFOR

PROBLEM TO BE SOLVED: To drastically shorten a process and to save materials by detecting the pattern position already written on a substrate, aligning a head and discharging a writing resin from the head by the position of the substrate while moving the substrate within a plane parallel with the he...

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Bibliographische Detailangaben
1. Verfasser:	SAKINO SHIGEO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FREQUENCY-CHANGING HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To drastically shorten a process and to save materials by detecting the pattern position already written on a substrate, aligning a head and discharging a writing resin from the head by the position of the substrate while moving the substrate within a plane parallel with the head, thereby having the arbitrary patterns written. SOLUTION: When the pattern is already written on the substrate 1 after the distance alignment between the head and the substrate, an X-Y stage 6 is moved to an alignment detection position and the alignment detection between the already written part and the head is executed by an alignment detector 4. The alignment is then executed by an actuator for θ driving on an θ-Z-tilt state 7. The actuator is thereafter moved to a writing start position by the X-Y stage 6 and the arbitrary patterns are written while the writing head 2 is subjected to the control of the discharge position and the discharge nozzle by a discharge control section 70. As a result, the drastic process shortening and material saving are made possible.