SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device into specified shape as required and to deal adequately with a high density mounting in practice. SOLUTION: A tape carrier package 13 is fixed through an insulative resin- made die bonding paste 19 onto one face 12A of an interposer 11 and mounted on the interposer 11 by conductively connecting the top ends of leads 5 to corresponding pads 15 of the interposer 11 via wires 20, it is encapsulated with an encapsulated resin 14 so as to protect connected parts by the wires 20. The tape carrier package 13 can be formed by cutting into a specified shape as required, and hence a semiconductor device 10 can be made small and deal adequately with a high-density mounting in practice.