ROTARY SUBSTRATE FOR ROUND SAW
PROBLEM TO BE SOLVED: To provide a structure in which a noise suppression effect is maintained, a structure capable of improving cutting accuracy and a structure which is excellent in the noise suppression effect by suppressing deviation of a slit opening part and suppressing falling-off of a fillin...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SHIRAISHI HIROZO |
| description | PROBLEM TO BE SOLVED: To provide a structure in which a noise suppression effect is maintained, a structure capable of improving cutting accuracy and a structure which is excellent in the noise suppression effect by suppressing deviation of a slit opening part and suppressing falling-off of a filling material, in a rotary substrate for round saw. SOLUTION: This rotary substrate is a rotary substrate 1 for round saw in which a sintered chip 2 containing diamond is mounted on an outer peripheral part, the chip 2 is used as a diamond saw blade, and a plurality of slits 3, 4 are provided. As the slits 3, 4, there are the substantially round bracket shaped first slit 3 and the substantially round bracket shaped second slit 4 which is arranged in the direction opposite to that of this slit 3. The first slit 3 and the second slit 4 are arranged so as to be a fixed relation and are constituted into a pair of slits. The one pair of slits are further arranged by fixed constitutions. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH11235668A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH11235668A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH11235668A3</originalsourceid><addsrcrecordid>eNrjZJAL8g9xDIpUCA51Cg4JcgxxVXDzD1II8g_1c1EIdgznYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEehoZGxqZmZhaOxsSoAQDMQCG_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ROTARY SUBSTRATE FOR ROUND SAW</title><source>esp@cenet</source><creator>SHIRAISHI HIROZO</creator><creatorcontrib>SHIRAISHI HIROZO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a structure in which a noise suppression effect is maintained, a structure capable of improving cutting accuracy and a structure which is excellent in the noise suppression effect by suppressing deviation of a slit opening part and suppressing falling-off of a filling material, in a rotary substrate for round saw. SOLUTION: This rotary substrate is a rotary substrate 1 for round saw in which a sintered chip 2 containing diamond is mounted on an outer peripheral part, the chip 2 is used as a diamond saw blade, and a plurality of slits 3, 4 are provided. As the slits 3, 4, there are the substantially round bracket shaped first slit 3 and the substantially round bracket shaped second slit 4 which is arranged in the direction opposite to that of this slit 3. The first slit 3 and the second slit 4 are arranged so as to be a fixed relation and are constituted into a pair of slits. The one pair of slits are further arranged by fixed constitutions.</description><edition>6</edition><language>eng</language><subject>BROACHING ; FILING ; GRINDING ; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PLANING ; POLISHING ; SAWING ; SCRAPING ; SHEARING ; SLOTTING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990831&DB=EPODOC&CC=JP&NR=H11235668A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990831&DB=EPODOC&CC=JP&NR=H11235668A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIRAISHI HIROZO</creatorcontrib><title>ROTARY SUBSTRATE FOR ROUND SAW</title><description>PROBLEM TO BE SOLVED: To provide a structure in which a noise suppression effect is maintained, a structure capable of improving cutting accuracy and a structure which is excellent in the noise suppression effect by suppressing deviation of a slit opening part and suppressing falling-off of a filling material, in a rotary substrate for round saw. SOLUTION: This rotary substrate is a rotary substrate 1 for round saw in which a sintered chip 2 containing diamond is mounted on an outer peripheral part, the chip 2 is used as a diamond saw blade, and a plurality of slits 3, 4 are provided. As the slits 3, 4, there are the substantially round bracket shaped first slit 3 and the substantially round bracket shaped second slit 4 which is arranged in the direction opposite to that of this slit 3. The first slit 3 and the second slit 4 are arranged so as to be a fixed relation and are constituted into a pair of slits. The one pair of slits are further arranged by fixed constitutions.</description><subject>BROACHING</subject><subject>FILING</subject><subject>GRINDING</subject><subject>LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PLANING</subject><subject>POLISHING</subject><subject>SAWING</subject><subject>SCRAPING</subject><subject>SHEARING</subject><subject>SLOTTING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAL8g9xDIpUCA51Cg4JcgxxVXDzD1II8g_1c1EIdgznYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEehoZGxqZmZhaOxsSoAQDMQCG_</recordid><startdate>19990831</startdate><enddate>19990831</enddate><creator>SHIRAISHI HIROZO</creator><scope>EVB</scope></search><sort><creationdate>19990831</creationdate><title>ROTARY SUBSTRATE FOR ROUND SAW</title><author>SHIRAISHI HIROZO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH11235668A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>BROACHING</topic><topic>FILING</topic><topic>GRINDING</topic><topic>LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PLANING</topic><topic>POLISHING</topic><topic>SAWING</topic><topic>SCRAPING</topic><topic>SHEARING</topic><topic>SLOTTING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIRAISHI HIROZO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIRAISHI HIROZO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ROTARY SUBSTRATE FOR ROUND SAW</title><date>1999-08-31</date><risdate>1999</risdate><abstract>PROBLEM TO BE SOLVED: To provide a structure in which a noise suppression effect is maintained, a structure capable of improving cutting accuracy and a structure which is excellent in the noise suppression effect by suppressing deviation of a slit opening part and suppressing falling-off of a filling material, in a rotary substrate for round saw. SOLUTION: This rotary substrate is a rotary substrate 1 for round saw in which a sintered chip 2 containing diamond is mounted on an outer peripheral part, the chip 2 is used as a diamond saw blade, and a plurality of slits 3, 4 are provided. As the slits 3, 4, there are the substantially round bracket shaped first slit 3 and the substantially round bracket shaped second slit 4 which is arranged in the direction opposite to that of this slit 3. The first slit 3 and the second slit 4 are arranged so as to be a fixed relation and are constituted into a pair of slits. The one pair of slits are further arranged by fixed constitutions.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH11235668A |
| source | esp@cenet |
| subjects | BROACHING FILING GRINDING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PLANING POLISHING SAWING SCRAPING SHEARING SLOTTING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | ROTARY SUBSTRATE FOR ROUND SAW |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T13%3A44%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHIRAISHI%20HIROZO&rft.date=1999-08-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH11235668A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |