ROTARY SUBSTRATE FOR ROUND SAW

PROBLEM TO BE SOLVED: To provide a structure in which a noise suppression effect is maintained, a structure capable of improving cutting accuracy and a structure which is excellent in the noise suppression effect by suppressing deviation of a slit opening part and suppressing falling-off of a fillin...

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Bibliographische Detailangaben
1. Verfasser:	SHIRAISHI HIROZO
Format:	Patent
Sprache:	eng
Schlagworte:	BROACHING FILING GRINDING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PLANING POLISHING SAWING SCRAPING SHEARING SLOTTING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a structure in which a noise suppression effect is maintained, a structure capable of improving cutting accuracy and a structure which is excellent in the noise suppression effect by suppressing deviation of a slit opening part and suppressing falling-off of a filling material, in a rotary substrate for round saw. SOLUTION: This rotary substrate is a rotary substrate 1 for round saw in which a sintered chip 2 containing diamond is mounted on an outer peripheral part, the chip 2 is used as a diamond saw blade, and a plurality of slits 3, 4 are provided. As the slits 3, 4, there are the substantially round bracket shaped first slit 3 and the substantially round bracket shaped second slit 4 which is arranged in the direction opposite to that of this slit 3. The first slit 3 and the second slit 4 are arranged so as to be a fixed relation and are constituted into a pair of slits. The one pair of slits are further arranged by fixed constitutions.