SEMICONDUCTOR DEVICE OF BGA-TYPE PACKAGE, MANUFACTURE THEREOF AND MOUNTING APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor device of a thin BGA-type package with a small press quantity of a cover plate in a flip chip connecting system, which connects an active element surface of a chip directed to a base board, manufacture thereof, and a mounting apparatus. SOLUTION: A flip-chip pad 8 is formed on one surface of a base board 3, a ball pad 9 is formed on the other surface, a chip 5 is mounted on the flip- chip pad 8 through a bump 6, and solder balls 4 are formed on ball pads 9. The base board 3 at a region for mounting the chip 5 is recessed to the solder ball 4 side. At the solder ball 4 side, the solder balls 4 protrude from the base board 3 at the chip-mounting region. The chip 5 and one surface of the base board 3 are covered with a cover plate 1. As a result, the package height can be reduced, and the planarity of the cover plate 1 can be held by reducing a press quantity of the cover plate 1 to zero or small.