SURFACE POLISHING DEVICE WITH WORK FLUID REMOVING MECHANISM AND WORK FLUID REMOVING METHOD

SURFACE POLISHING DEVICE WITH WORK FLUID REMOVING MECHANISM AND WORK FLUID REMOVING METHOD

PROBLEM TO BE SOLVED: To enable a work fluid of polishing fluid, rinse fluid, etc., left on a work surface of a surface plate to be removed easily and automatically. SOLUTION: A suction water head 17 of a work fluid removing mechanism 6 set up in a surface polishing device is connected to a suction...

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1. Verfasser: HAKOMORI SHIYUNJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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creator HAKOMORI SHIYUNJI
description PROBLEM TO BE SOLVED: To enable a work fluid of polishing fluid, rinse fluid, etc., left on a work surface of a surface plate to be removed easily and automatically. SOLUTION: A suction water head 17 of a work fluid removing mechanism 6 set up in a surface polishing device is connected to a suction pump 22, the suction water head 17 is brought into contact with a work surface of a surface plate 2 after a work-finished workpiece is removed, the surface plate 2 is rotated, also while moving the suction water head 17 in the radial direction of the surface plate, a work fluid on the work surface is sucked by the suction pump 22.
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subjects BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
title SURFACE POLISHING DEVICE WITH WORK FLUID REMOVING MECHANISM AND WORK FLUID REMOVING METHOD
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