SURFACE POLISHING DEVICE WITH WORK FLUID REMOVING MECHANISM AND WORK FLUID REMOVING METHOD

PROBLEM TO BE SOLVED: To enable a work fluid of polishing fluid, rinse fluid, etc., left on a work surface of a surface plate to be removed easily and automatically. SOLUTION: A suction water head 17 of a work fluid removing mechanism 6 set up in a surface polishing device is connected to a suction...

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Bibliographische Detailangaben
1. Verfasser:	HAKOMORI SHIYUNJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable a work fluid of polishing fluid, rinse fluid, etc., left on a work surface of a surface plate to be removed easily and automatically. SOLUTION: A suction water head 17 of a work fluid removing mechanism 6 set up in a surface polishing device is connected to a suction pump 22, the suction water head 17 is brought into contact with a work surface of a surface plate 2 after a work-finished workpiece is removed, the surface plate 2 is rotated, also while moving the suction water head 17 in the radial direction of the surface plate, a work fluid on the work surface is sucked by the suction pump 22.