MANUFACTURE OF TITANIUM FOR CU FOIL MANUFACTURING DRUM, AND TITANIUM SLAB USED FOR THE MANUFACTURE

PROBLEM TO BE SOLVED: To eliminate scratch flaws generated through transfer by providing a slab whose recrystallization texture ratio in the thickness direction exceeds the prescribed value and to realize the uniform and dense macroscopic structure of the surface. SOLUTION: A slab is used in manufac...

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Bibliographische Detailangaben
Hauptverfasser: KAWAHARA YOSHINAO, KUSANO AKIHIKO, YAMADA NAOTOMI, ISHII MITSUO, NAGAI ISAO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To eliminate scratch flaws generated through transfer by providing a slab whose recrystallization texture ratio in the thickness direction exceeds the prescribed value and to realize the uniform and dense macroscopic structure of the surface. SOLUTION: A slab is used in manufacturing titanium for an electrolytic Cu foil manufacturing drum whose recrystallization texture ratio in the thickness direction exceeds 90%. The slab is hot-rolled at the total draft (thickness before rolling/thickness after rolling) of 15, and annealed to obtain the titanium for a Cu foil manufacturing drum. A raw material whose recrystallization ratio in the manufacturing process of the raw material (the slat for hot-rolling a thick plate), e.g. in a forging and blooming process of an ingot, is controlled over the whole thickness, is manufactured, and the macroscopic structure is unified until the raw material is turned into a thick plate to be used as a stock material for the Cu foil manufacturing drum through the subsequent working processes.