PLATE GLASS FOR ELECTRONIC PART

PROBLEM TO BE SOLVED: To provide a plate glass 1 for an electronic part by filleting the corners of the approximately rectangular plate glass in inwardly depressed approximately circular shapes, respectively, to improve the airtightness of a package for the electronic part and enhance the reliabilit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SANBE SHUJI, KUSAKABE MASAYOSHI, MASUDA SETSUO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a plate glass 1 for an electronic part by filleting the corners of the approximately rectangular plate glass in inwardly depressed approximately circular shapes, respectively, to improve the airtightness of a package for the electronic part and enhance the reliability. SOLUTION: The corners of a plate glass 1 for an electronic part are printed and coated with a thermosetting epoxy resin adhesive 4 with a screen printing machine, wherein the corners are brought into contact with a package 2. Therein, large amounts of the adhesive 4 are adhered to the approximately circular inward depressed fillet portions 1a of the plate glass 1. The plate glass 1 is fit into the upper fitting portion 3 of the package 2. The package 2 is then charged in an oven and heated to cure the adhesive 4, thus bonding the plate glass 1 to the package 2. Thereby, the contact areas of the fillet portions 1a of the plate glass with the fitting portions 3 of the package are larger by about 5% than those of a C fillet plate glass. Consequently, the contact strength is improved, and the adhesive stored in spaces between the fillet portions 1a and the fitting portions 3 forms buffering layers at the corner portions liable to concentrate stresses and protects the corners.