METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFER
PROBLEM TO BE SOLVED: To improve cleaning effects for a group of semiconductor wafers. SOLUTION: An apparatus for cleaning a series of semiconductor wafers in which a group of semiconductor wafers obtained by cutting a semiconductor ingot by a wafer slicer are dipped in a cleaning liquid 5 in a clea...
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| creator | NISHIDA NOBUO YOSHIDA SHUNZO KANAYAMA TADASHI MURATSUBAKI RYOJI TAKIMAE MASANORI |
| description | PROBLEM TO BE SOLVED: To improve cleaning effects for a group of semiconductor wafers. SOLUTION: An apparatus for cleaning a series of semiconductor wafers in which a group of semiconductor wafers obtained by cutting a semiconductor ingot by a wafer slicer are dipped in a cleaning liquid 5 in a cleaning chamber 1 has a pressure chamber 3 for supplying the cleaning liquid to the cleaning chamber 1 and pressurizing and depressurizing means 7, 9 for supplying alternately pressurized gas to the pressure chamber 3 or exhausting the pressurized gas from the pressure chamber 3 to raise or lower the level of the cleaning liquid. |
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SOLUTION: An apparatus for cleaning a series of semiconductor wafers in which a group of semiconductor wafers obtained by cutting a semiconductor ingot by a wafer slicer are dipped in a cleaning liquid 5 in a cleaning chamber 1 has a pressure chamber 3 for supplying the cleaning liquid to the cleaning chamber 1 and pressurizing and depressurizing means 7, 9 for supplying alternately pressurized gas to the pressure chamber 3 or exhausting the pressurized gas from the pressure chamber 3 to raise or lower the level of the cleaning liquid.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT ; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MACHINE TOOLS ; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE ; TRANSPORTING</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990806&DB=EPODOC&CC=JP&NR=H11214336A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990806&DB=EPODOC&CC=JP&NR=H11214336A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NISHIDA NOBUO</creatorcontrib><creatorcontrib>YOSHIDA SHUNZO</creatorcontrib><creatorcontrib>KANAYAMA TADASHI</creatorcontrib><creatorcontrib>MURATSUBAKI RYOJI</creatorcontrib><creatorcontrib>TAKIMAE MASANORI</creatorcontrib><title>METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFER</title><description>PROBLEM TO BE SOLVED: To improve cleaning effects for a group of semiconductor wafers. 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SOLUTION: An apparatus for cleaning a series of semiconductor wafers in which a group of semiconductor wafers obtained by cutting a semiconductor ingot by a wafer slicer are dipped in a cleaning liquid 5 in a cleaning chamber 1 has a pressure chamber 3 for supplying the cleaning liquid to the cleaning chamber 1 and pressurizing and depressurizing means 7, 9 for supplying alternately pressurized gas to the pressure chamber 3 or exhausting the pressurized gas from the pressure chamber 3 to raise or lower the level of the cleaning liquid.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPH11214336A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING |
| title | METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFER |
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