SEMICONDUCTOR PRESSURE SENSOR

PROBLEM TO BE SOLVED: To simplify the structure of a pressure sensor itself and to assemble the pressure sensor to a housing body in a compacter state. SOLUTION: The semiconductor pressure sensor 1 is constituted in such a way that the sensor 1 is provided with a semiconductor sensor element for det...

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1. Verfasser: ICHIHASHI MOTOMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To simplify the structure of a pressure sensor itself and to assemble the pressure sensor to a housing body in a compacter state. SOLUTION: The semiconductor pressure sensor 1 is constituted in such a way that the sensor 1 is provided with a semiconductor sensor element for detecting pressure which is supported by a sensor main body 4 through a pedestal 3 and can detect a pressure medium when the sensor 1 is assembled to a housing body 10 which separates the pressure medium and an external So from each other. The main body 4 is formed in a plate shape having a flange section 4b and a prescribed thickness and the pedestal 3 which supports the sensor element 2 stuck to the pedestal 3 and the adjusting circuit board 6 of the sensor element 2 are bonded to one face side of the main body 4. The main body 4 is fixed in such a state that the main body 4 is put in the stepped through hole 10H of the housing body 10.