MANUFACTURE OF MULTILAYER PRINTED-WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-wiring board providing satisfactory results of outer appearance, molding properties, resin flow and unevenness of product temperature when a multilayer printed- wiring board is manufactured by the direct heating method....

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Bibliographische Detailangaben
1. Verfasser:	OTO NORIYASU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-wiring board providing satisfactory results of outer appearance, molding properties, resin flow and unevenness of product temperature when a multilayer printed- wiring board is manufactured by the direct heating method. SOLUTION: In a manufacturing method, materials formed of an inner layer circuit plate 3 and a prepreg 1 are laminated in multi-stages in the state of being clamped by a metal foil 2 by bending a continuous combined material formed of the laminate constituted of the inner layer circuit 3 and the prepreg 1 being clamped by a continuous metal oil 2, and power is applied to the metal foil 2 to heat the metal foil 2, and the laminate is pressure molded while being heated, by which the inner layer circuit plate 3, the prepreg 1 and the metal foil 2 are laminated and integrated together to manufacture a multilayer printed- wiring board. In that case, the temperature rise speed at the time of heating the laminates is adjusted to 8-10 deg.C/minute until the internal temperature of the laminate reaches 90 deg.C, 1.5-2.5 deg.C from staring at 90 deg.C to reaching 140 deg.C and 5-7 deg.C/minute from starting at 140 deg.C and reaching 180 deg.C.