SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device whose memory capacity can easily be increased, or to which a logic function can easily be added and whose flexibility on design is high. SOLUTION: A second semiconductor chip 5 into which a circuit for extending the function of a semiconductor chip 1 is incorporated is loaded on the first semiconductor chip 1 fixed on the upper face of a mounted board 13 through an insertion board 9 having an inner layer wiring and they are fixed by resins 8a and 8b. The inner electrode pad 6 of the second semiconductor chip 5 is connected to an inner electrode pad 12 of the insertion board 9 through a bump 11. An inner electrode pad 10 of the insertion board 9 is connected to the inner electrode pad 4 of the first semiconductor chip 1 through a bump 7. The outer electrode 3 of the first semiconductor chip 1 is connected to a board wiring 15 of the mounted board 13 through a wire 16.