TIN-CONTAINING COPPER ALLOY MATERIAL FOR ELECTRONIC AND ELECTRICAL PART, EXCELLENT IN SILVER PLATABILITY
PROBLEM TO BE SOLVED: To obtain an Sn-containing copper alloy material for electronic and electrical parts, excellent in Ag platability after Cu undercoat plating as well as in Ag platability. SOLUTION: The amount of existence of Sn at the surface of an Sn- containing copper alloy material is regula...
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| creator | KAWAGUCHI MASAHIRO MASAGO YASUSHI TSUNO RIICHI MATSUI TAKASHI KANAO KENJI |
| description | PROBLEM TO BE SOLVED: To obtain an Sn-containing copper alloy material for electronic and electrical parts, excellent in Ag platability after Cu undercoat plating as well as in Ag platability. SOLUTION: The amount of existence of Sn at the surface of an Sn- containing copper alloy material is regulated so that the value of Sn3d/Cu2p as the peak-area area ratio of quantitative analysis by the X-ray photoelectron spectroscopy becomes |
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SOLUTION: The amount of existence of Sn at the surface of an Sn- containing copper alloy material is regulated so that the value of Sn3d/Cu2p as the peak-area area ratio of quantitative analysis by the X-ray photoelectron spectroscopy becomes <=0.2, for which the oxidation of Sn at the surface of a stock is required. To be concrete, it is necessary to properly regulate an annealing atmosphere in a manufacturing process or an acid pickling method after annealing. 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| subjects | ALLOYS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES TESTING TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| title | TIN-CONTAINING COPPER ALLOY MATERIAL FOR ELECTRONIC AND ELECTRICAL PART, EXCELLENT IN SILVER PLATABILITY |
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