TIN-CONTAINING COPPER ALLOY MATERIAL FOR ELECTRONIC AND ELECTRICAL PART, EXCELLENT IN SILVER PLATABILITY

PROBLEM TO BE SOLVED: To obtain an Sn-containing copper alloy material for electronic and electrical parts, excellent in Ag platability after Cu undercoat plating as well as in Ag platability. SOLUTION: The amount of existence of Sn at the surface of an Sn- containing copper alloy material is regula...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAGUCHI MASAHIRO, MASAGO YASUSHI, TSUNO RIICHI, MATSUI TAKASHI, KANAO KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES TESTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an Sn-containing copper alloy material for electronic and electrical parts, excellent in Ag platability after Cu undercoat plating as well as in Ag platability. SOLUTION: The amount of existence of Sn at the surface of an Sn- containing copper alloy material is regulated so that the value of Sn3d/Cu2p as the peak-area area ratio of quantitative analysis by the X-ray photoelectron spectroscopy becomes