OPTICAL SEMICONDUCTOR MODULE
PROBLEM TO BE SOLVED: To reduce the size of an optical semiconductor module and raise the speed thereof. SOLUTION: An envelope 2 incorporates an optical semiconductor element 3, sub-carrier 4 mounting this element 3, conductive substrate 7 mounting the sub-carrier 4, semiconductor heating/cooling el...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To reduce the size of an optical semiconductor module and raise the speed thereof. SOLUTION: An envelope 2 incorporates an optical semiconductor element 3, sub-carrier 4 mounting this element 3, conductive substrate 7 mounting the sub-carrier 4, semiconductor heating/cooling elements mounting the substrate 7 and wiring board 10 mounting a drive element 9 for driving the semiconductor element 3. The module has an optical receptacle 1 at one side of the envelope 2 outside, and a coaxial receptacle 16 with d-c voltage leads 15 at the opposite side. |
---|