OPTICAL SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To reduce the size of an optical semiconductor module and raise the speed thereof. SOLUTION: An envelope 2 incorporates an optical semiconductor element 3, sub-carrier 4 mounting this element 3, conductive substrate 7 mounting the sub-carrier 4, semiconductor heating/cooling el...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IWASAKI NOBORU, YANAGIBASHI MITSUAKI, ISHIZUKA FUMINORI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To reduce the size of an optical semiconductor module and raise the speed thereof. SOLUTION: An envelope 2 incorporates an optical semiconductor element 3, sub-carrier 4 mounting this element 3, conductive substrate 7 mounting the sub-carrier 4, semiconductor heating/cooling elements mounting the substrate 7 and wiring board 10 mounting a drive element 9 for driving the semiconductor element 3. The module has an optical receptacle 1 at one side of the envelope 2 outside, and a coaxial receptacle 16 with d-c voltage leads 15 at the opposite side.