MANUFACTURE OF HEAT SLINGER FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing heat slinger for semiconductor device, by which a flat surface formed on the projecting section of a metallic plate obtained by press working, etc., can be flattened to such a degree that a semiconductor element, etc., can be mounted on the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOIZUMI YOSHIHARU, UMEMOTO SHUNICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FORGE FURNACES FORGING HAMMERING MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES,RIVETS, BOLTS OR WHEELS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PRESSING METAL PUNCHING METAL RIVETING SEMICONDUCTOR DEVICES TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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