MANUFACTURE OF HEAT SLINGER FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing heat slinger for semiconductor device, by which a flat surface formed on the projecting section of a metallic plate obtained by press working, etc., can be flattened to such a degree that a semiconductor element, etc., can be mounted on the...

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Bibliographische Detailangaben
Hauptverfasser:	KOIZUMI YOSHIHARU, UMEMOTO SHUNICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FORGE FURNACES FORGING HAMMERING MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES,RIVETS, BOLTS OR WHEELS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PRESSING METAL PUNCHING METAL RIVETING SEMICONDUCTOR DEVICES TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing heat slinger for semiconductor device, by which a flat surface formed on the projecting section of a metallic plate obtained by press working, etc., can be flattened to such a degree that a semiconductor element, etc., can be mounted on the surface. SOLUTION: After a projecting section 12 is protruded from one surface of a belt-like metallic plate 10 by forming a recessed section 18 on the other surface of the plate 10 by press working, the plate 10 is held between a first spacer 20 having a recessed section 26 formed correspondingly to the projecting section 12 of the plate 10 and a second spacer 22 having a projecting section 30 formed correspondingly to the recessed section 18 of the plate 10, and the upper surface 12a of the projecting section 12 of the plate 10 is flattened by heat-treating the plate 10 while the plate 10 is pressed.