WATER-BASED THERMOSETTING RESIN EMULSION FOR ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing printed wiring circuit boards which eliminates use of a large vol. of org. solvents. SOLUTION: High quality, in-spec prepregs are obtd. by utilization of water- based epoxy resin emulsions. These prepregs are identical to those prepd. by us...

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Hauptverfasser:	STANLEY J WHITEHAIR, HEDRICK JEFFREY C, COSTAS PAPATHOMAS, STEPHEN LEO TEASDALE, DAVID ANDREW LEWIS, VIEHBECK ALFRED
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MAKING GRANULES OR PREFORMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing printed wiring circuit boards which eliminates use of a large vol. of org. solvents. SOLUTION: High quality, in-spec prepregs are obtd. by utilization of water- based epoxy resin emulsions. These prepregs are identical to those prepd. by using conventional org. solvents and have the same level of B-stage cure and comparable rheological properties with the conventional prepregs. Laminates fabricated from these prepregs possess equivalent or improved thermal, adhesive and hydroscopic properties to the conventional prepregs.