SEMICONDUCTOR PACKAGE STRUCTURE UTILIZING EPOXY MOLDING COMPOUND AND MANUFACTURE OF EPOXY MOLDING COMPOUND

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package, by utilizing a semiconductor package structure capable of maintaining a sufficient withstand voltage and capable of low cost production and utilizing EMC (epoxy molding compound). SOLUTION: This method includes a fi...

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1. Verfasser: NAN JIHAKU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package, by utilizing a semiconductor package structure capable of maintaining a sufficient withstand voltage and capable of low cost production and utilizing EMC (epoxy molding compound). SOLUTION: This method includes a first semiconductor chip bonded on a die-pad 5 via an electrically conductive bonding agent 4, an EMC pad 6' bonded on the die-pad 5 via a first insulating bonding agent, and a second semiconductor chip bonded on the EMC pad 6' via a second insulating bonding agent 7'. Then, a predetermined amount of EMC tablet is prebaked and an EMC pad prototype with a predetermined thickness is molded by pressing the tablet utilizing a die, and the prototype is cooled. Further, its thickness and the void generation in it are inspected and the EMC pad prototype is hardened so that the constructing materials react each other completely and it is sawn into predetermined size ones.