LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To prevent a hardened material of a sealing resin from being clogged in an air relief of a metal mold by a method, wherein notch parts provided on both sides of suspension leads formed extending from the corner parts of a led frame are provided at positions where the notch part...

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Bibliographische Detailangaben
1. Verfasser:	KANO TAKETOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent a hardened material of a sealing resin from being clogged in an air relief of a metal mold by a method, wherein notch parts provided on both sides of suspension leads formed extending from the corner parts of a led frame are provided at positions where the notch parts correspond to the air reliefs of the metal mold for resin encapsulation. SOLUTION: Triangle-shaped notch parts 4 are respectively provided on both sides of each of suspension leads 2 formed extending from the corner parts of a lead frame 1. Thereby as resin, which is flowed in air reliefs of a metal mold for resin encapsulation, is hardened in a state that the resin is wound on the leads 2, a hardened material of the encapsulating resin flowed in the air reliefs of the metal mold for resin sealing is adhered to the side of the lead frame 1, without adhering to the metal mold. Therefore, the hardened material of the sealing resin can be prevented from being clogged in the air reliefs of the metal mold.