LAMINATED CHIP PART AND MANUFACTURE THEREOF
PROBLEM TO BE SOLVED: To provide a laminated chip part, where an inner conductor is kept free from disconnection and a connection failure and which is restrained from deteriorating in characteristics by a method wherein a wedge-shaped part is provided to the edge of an inner conductor pattern. SOLUT...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a laminated chip part, where an inner conductor is kept free from disconnection and a connection failure and which is restrained from deteriorating in characteristics by a method wherein a wedge-shaped part is provided to the edge of an inner conductor pattern. SOLUTION: Two conductor patterns P are formed on the surface of a ceramic magnetic sheet 1 through a screen printing method, and two non-pattern magnetic sheets where no pattern is provided are laminated sandwiching the above ceramic magnetic sheet 1 between them. Hereupon, a wedge-shaped K (wedged-shaped pattern K) is provided to both the start end and terminal end of the conductor pattern P. The wedge-shaped pattern K is formed by the shape of a stencil when screen printing is carried out, and the wedge-shaped patterns K are provided to the suitable parts of the conductor pattern P so as to make their tips confront each other, to be tapered shapes to the contraction of the conductor pattern K, and to serve as a stopper with respect to the tensile force of the conductor pattern K in a sintering process after the sheets are laminated and bonded together by pressure. |
---|