LIQUID MATERIAL FLOW CONTROL PUMP

PROBLEM TO BE SOLVED: To supply a semiconductor manufacturing CVD liquid material with high accuracy by filling an operating fluid into bellows to partition the inside of a casing, and constituting so as to suck in/deliver the liquid material by varying the volume of the bellows by sliding motion of...

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Bibliographische Detailangaben
Hauptverfasser: YONEYAMA GAKUO, TAKAMATSU YUKICHI, ISHIHAMA YOSHIYASU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To supply a semiconductor manufacturing CVD liquid material with high accuracy by filling an operating fluid into bellows to partition the inside of a casing, and constituting so as to suck in/deliver the liquid material by varying the volume of the bellows by sliding motion of a piston arranged in these bellows. SOLUTION: The inside of a casing 1 is partitioned into two chambers by bellows 2 having a large number of pleats, and an operating fluid 4 is sealed in an inside chamber of the bellows 2, and a piston 3 is fitted/installed. A suction side piping joint 6 enclosing a suction valve 8 communicating with an outside chamber of the bellows 2 in upper and lower parts and a delivery side piping joint 7 enclosing a delivery valve 9 actuated by a pressure difference of 1.0 to 100 kg/cm , are installed in the casing 1. A liquid material 5 can be supplied in fixed quantity by delivering this by increasing pressure by sucking the liquid material 5 in the outside chamber of the bellows 2 according to the volumetric change by reducing/expanding a shape of the bellows 2 by reciprocatively slidingly moving the piston 3 in the axial direction.