EMBOSS CARRIER TAPE STRUCTURE IN TAPE-LIKE PACKAGE FOR ELECTRONIC PART

PROBLEM TO BE SOLVED: To allow a cover tape to be thermally pressure-fitted to an emboss carrier tape with approximately the same strength along its lengthwise direction by providing swells protruding upward along the lengthwise direction of the emboss carrier tape at both right and left side rims of the tape. SOLUTION: Swells 5, 6 protruding upward are provided along a lengthwise direction of an emboss carrier tape 1 on both left and right side rims 1a, 1b of the carrier tape 1 equipped with part housings 3 for loading electronic parts 2 one by one at appropriate intervals along the lengthwise direction. When a cover tape 4 is put over an upper face of the emboss carrier tape 1, and the cover tape 4 is thermally pressure-fitted to the emboss carrier tape 1 by interposing them between a pair of heating molds, thermal pressure fitting can be concentrated on both swells 5, 6, whereby fluctuation in thermal pressure fitting strength along the lengthwise direction between the cover tape 1 and the emboss carrier tape 1 can be reduced.