MANUFACTURE OF DOUBLE-SIDED PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To manufacture a double-sided printed wiring board high both in wiring density and soldering land density at a low cost. SOLUTION: A copper layer 42 is electrodeposited on the surface of an electrode 41, a photosensitive insulating layer 43 is applied on the copper layer 42, through-holes 39 are provided to the insulating layer 43 by photolithography technique, and a copper layer 45 is electrodeposited on the surface of the insulating layer 43. The through-holes 39 are each easily made small in diameter through photolithography technique, and a wide region required for patterning of a wiring can be secured. The through-holes 39 are filled up with the copper layer 45, so that an exclusive process where the through-holes 39 are filled up can be dispensed with.