SUBSTRATE HOUSING ENCLOSURE AND METHOD OF TREATING SUBSTRATES
PROBLEM TO BE SOLVED: To provide a substrate housing enclosure which prevents a semiconductor element manufacturing substrate form contamination and the semiconductor element on this substrate from electrostatic breakdown. SOLUTION: A slot plate A 2 for forming a substrate housing container for hous...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a substrate housing enclosure which prevents a semiconductor element manufacturing substrate form contamination and the semiconductor element on this substrate from electrostatic breakdown. SOLUTION: A slot plate A 2 for forming a substrate housing container for housing a semiconductor wafer 1 is made from an Al alloy base metal A 4 which is covered with a semiconductive ceramic film 5 controlled to provide a resistance of 10 -10 Ω/sq. with an anticorrosive SiC film 6 having a conductivity higher than that of the semiconductive ceramic film 5, covering portions to be directly contacted to the semiconductor wafer 1. |
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