CHEMICAL VAPOR DEPOSITION FILM-FORMING DEVICE

PROBLEM TO BE SOLVED: To provide a device for forming a CVD film whose thickness and quality over the entirety thereof, specifically at the periphery and at the central portion of a wafer, are uniform. SOLUTION: There is provided with a device for forming a film by chemical vapor deposition, compris...

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Bibliographische Detailangaben
1. Verfasser: NOHAMA SHIYOUJI
Format: Patent
Sprache:eng
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