PATTERN DEFECT INSPECTION METHOD AND DEVICE THEREFOR

PROBLEM TO BE SOLVED: To provide an inspection method by which such an error is not judged as a defect even if there are deformation, strain of patterns and a positioning error between a standard pattern and an inspection object detecting pattern in a wiring board by applying a different inspection standard to patterns or respective layers in an inspection of a multilayer pattern on a multilayer wiring board to which a solder resist is applied. SOLUTION: Inspection object patterns are detected, and labeled with respective patterns mutually separated in the detected patterns, and a feature quantity of the labeled individual patterns is calculated, and a table relating this feature quantity to positions of the labeled patterns is made. Meanwhile, a pattern being a standard for these inspection object patterns is prepared, and a feature quantity of a standard pattern is also similarly calculated, and a table releated to coordinates is made. In a pattern inspection, feature quantities of nearby patterns equivalent to corresponding coordinates of the table are compared with each other, and feature quantites of the inspection object patterns and the standard pattern are compared with each other, and a defect is detected.