RESIST MATERIAL FOR PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To obtain a resist material for a printed circuit board having very high resolution as well as sufficient toughness and adhesion to a conductor layer. SOLUTION: Polyether sulfone is added and dissolved by 1.5 g in 8.75 g N-methyl-2-pyrrolidone, 1.5 g diethylene glycol dimethyl...

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Bibliographische Detailangaben
Hauptverfasser:	IGAI NORIHIKO, OKUYAMA MASAHIKO, MIZUSHIMA YASUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a resist material for a printed circuit board having very high resolution as well as sufficient toughness and adhesion to a conductor layer. SOLUTION: Polyether sulfone is added and dissolved by 1.5 g in 8.75 g N-methyl-2-pyrrolidone, 1.5 g diethylene glycol dimethyl ether is added and 3.75 g o-cresol novolak type epoxy resin and 1.0 g bisphenol A type epoxy resin are further added. They are agitated until the resins are dissolved, 0.44 g sulfonium salt as a photo-acid generating agent is added to form an epoxy- PES composite body and 1.26 g acrylic filler is added to the composite body and kneaded by means of three rolls to obtain the objective resist material, for a printed circuit board. When the top of a substrate is coated with the resist material by means of a spin coater and the resist material is dried, patternwise exposed by irradiation with UV through a prescribed mask and post-baked, a fine pattern is satisfactorily formed.