SOLDER BUMP FORMATION METHOD

PROBLEM TO BE SOLVED: To provide a solder bump formation method with improved working efficiency that can prevent the generation of bump formation failure, namely the non-adhesion of solder bump onto a bump pad or the formation of solder bump with a small diameter. SOLUTION: A metal mask 6 is arrang...

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Bibliographische Detailangaben
Hauptverfasser:	HOSOYA MASAKAZE, SATO NOBUO, TSUNETSUGU HIDEKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solder bump formation method with improved working efficiency that can prevent the generation of bump formation failure, namely the non-adhesion of solder bump onto a bump pad or the formation of solder bump with a small diameter. SOLUTION: A metal mask 6 is arranged on a substrate where a bump is formed such as a semiconductor element, a circuit device, or a wiring board where the solder bump is formed and a metal frame 8 is arranged on it, and then a solder ball 3 is dropped into a through hole 7 of the metal mask 6, the solder ball 3 is pressed and pressurized with a force for preventing the solder ball 3 from being deformed by a solder ball presser plate 9 from an upper part and is heated in pressurized state and the solder ball 3 is melted. After that, the solder ball presser plate 9, the metal frame 8, and the metal mask 6 are pulled up and then are cooled for coagulating solder and forming a solder bump 11.