MOUNTING STRUCTURE FOR SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To appropriately connect electrodes to desired areas being wiring connecting objects at the time of mounting plural semiconductor chips through the use of the structure of what is called chip-on-chip. SOLUTION: In a mounting structure of a semiconductor chips, plural semiconductor chips 2A-2C are overlapped in the direction of thickness and plural electrodes 21a-21c provided for the plural semiconductor chips 2A-2C are connected to areas 10 being the wiring connection objects, which are positioned on sides through plural wires W. Wire bonding faces of the areas 10 being the wiring connection objects are provided in the middle height of the surfaces between the electrode 21c in the highest position and the electrode 21c in the lowest position.