PREPARATION OF WOOD ADHESIVE

PROBLEM TO BE SOLVED: To provide a low-temperature, fast-curing phenolic resin adhesive which is low in formaldehyde smell. SOLUTION: A phenol-formaldehyde resol resin is obtained through condensation of phenols and formaldehyde in the presence of an alkaline catalyst. In the first step, the molar r...

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Bibliographische Detailangaben
1. Verfasser:	SHIODA YOZO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NAILING OR STAPLING MACHINES IN GENERAL NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL WORKING VENEER OR PLYWOOD
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a low-temperature, fast-curing phenolic resin adhesive which is low in formaldehyde smell. SOLUTION: A phenol-formaldehyde resol resin is obtained through condensation of phenols and formaldehyde in the presence of an alkaline catalyst. In the first step, the molar ratio of formaldehyde against phenols is from 2.0 to 3.0 and the reaction is allowed to continue until the viscosity determined by the Brookfield type viscometer at 25 deg.C within a non-volatile component of 50 to 60% reaches 1.5 to 4.5 ps. Then, in the second step, phenols or phenols and formaldehyde are added to decrease the molar ratio of formaldehyde against phenols to 1.2 to 1.8, and the reaction is allowed to continue until the viscosity determined by the Brookfield type viscometer at 25 deg.C within a non-volatile component of 48 to 60% reaches 6.0 to 15.0 ps.