EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To obtain the subject composition capable of increasing a transmitting rate of a signal, useful for a semiconductor device, etc., and having a high dielectric constant by using each specific epoxy resin and inorganic filter as essential components. SOLUTION: This epoxy resin co...
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| creator | ISHII TOSHIAKI EGUCHI KUNIYUKI MOGI AKIRA |
| description | PROBLEM TO BE SOLVED: To obtain the subject composition capable of increasing a transmitting rate of a signal, useful for a semiconductor device, etc., and having a high dielectric constant by using each specific epoxy resin and inorganic filter as essential components. SOLUTION: This epoxy resin composition consists essentially of (A) a biphenyl type epoxy resin of formula I, (B) a xylylene type phenol resin of formula II [(n) is 2-31, and (C) an inorganic filler. The component C is alumina and filling amount of the alumina is >=55 vol.%. Preferably, the alumina is used in combination with silica as the component C, the filling amount of the inorganic filler is 60 vol.%, and the proportion of the alumina in the whole inorganic filler is 30 vol.%. |
| format | Patent |
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SOLUTION: This epoxy resin composition consists essentially of (A) a biphenyl type epoxy resin of formula I, (B) a xylylene type phenol resin of formula II [(n) is 2-31, and (C) an inorganic filler. The component C is alumina and filling amount of the alumina is >=55 vol.%. 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SOLUTION: This epoxy resin composition consists essentially of (A) a biphenyl type epoxy resin of formula I, (B) a xylylene type phenol resin of formula II [(n) is 2-31, and (C) an inorganic filler. The component C is alumina and filling amount of the alumina is >=55 vol.%. Preferably, the alumina is used in combination with silica as the component C, the filling amount of the inorganic filler is 60 vol.%, and the proportion of the alumina in the whole inorganic filler is 30 vol.%.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
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