EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain the subject composition capable of increasing a transmitting rate of a signal, useful for a semiconductor device, etc., and having a high dielectric constant by using each specific epoxy resin and inorganic filter as essential components. SOLUTION: This epoxy resin co...

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Bibliographische Detailangaben
Hauptverfasser:	ISHII TOSHIAKI, EGUCHI KUNIYUKI, MOGI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain the subject composition capable of increasing a transmitting rate of a signal, useful for a semiconductor device, etc., and having a high dielectric constant by using each specific epoxy resin and inorganic filter as essential components. SOLUTION: This epoxy resin composition consists essentially of (A) a biphenyl type epoxy resin of formula I, (B) a xylylene type phenol resin of formula II [(n) is 2-31, and (C) an inorganic filler. The component C is alumina and filling amount of the alumina is >=55 vol.%. Preferably, the alumina is used in combination with silica as the component C, the filling amount of the inorganic filler is 60 vol.%, and the proportion of the alumina in the whole inorganic filler is 30 vol.%.