CERAMIC BALL GRID ARRAY USING ON-SITE EXTENSION OF SOLDER

PROBLEM TO BE SOLVED: To form an extended solder bond between two electronic substrates which are mutually connected by the solder to form an electronic module, by heating the two substrates, imparting controlled separating force to the solder bond plasticized by the heat between the substrates, extending the solder bond, and refrigerating the resultant module to set the extended solder bond. SOLUTION: Solder bonds 12 having a height S are generally used for treating a printed circuit board or the like, i.e., a substrate 11, which is connected to a chip, i.e., a substrate 13. Specifically, the solder bonds 12 are formed between these two electronic substrates 11, 13 to form a mutually connected electronic module. Thereafter, the module is heated to plasticize the solder bonds 12. Subsequently, separating power is imparted to the two electronic substrates 11, 13 so as to extend the plasticized solder bonds 12, thereby forming an extended solder bond. Then, the module thus extended is refrigerated to complete the electronic module comprising the extended solder bond.