EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which has been improved in storage stability without detriment to its good heat resistance by using a specific compd. as a curative component. SOLUTION: This compsn. is prepd. by compounding an epoxy compd. (A) having at least two epoxy groups,...

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Bibliographische Detailangaben
1. Verfasser:	OKUMOTO SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. which has been improved in storage stability without detriment to its good heat resistance by using a specific compd. as a curative component. SOLUTION: This compsn. is prepd. by compounding an epoxy compd. (A) having at least two epoxy groups, a B-stage compd. (B) obtd. by reacting an epoxy compd. having at least two epoxy groups with an isocyanate compd. having at least two isocyanate goups, a curative other than an isocyanate compd. and a cure catalyst. Compd. B can be obtd. by thermally reacting an epoxy compd. dissolved in a solvent (e.g. DMSO or DMF) with an isocyanate compd. in the presence of a basic cure catalyst (e. g. an imidazole compd. or a tert. amine). Pref. the compounding ratio of compd. B to compd. A is 1-30wt.%.