MANUFACTURE OF ELECTRONIC COMPONENT MOUNTING BOARD
PROBLEM TO BE SOLVED: To simplify the manufacturing process. SOLUTION: A through-hole is formed in a thick adhesive film 21. A core board 5 is provided under the thick adhesive film 21 with a thin adhesive film 22 covering the through-hole therebetween. On the other hand, a conductor foil 1 is provi...
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| creator | TAKADA MASATOME TSUKADA KIYOTAKA |
| description | PROBLEM TO BE SOLVED: To simplify the manufacturing process. SOLUTION: A through-hole is formed in a thick adhesive film 21. A core board 5 is provided under the thick adhesive film 21 with a thin adhesive film 22 covering the through-hole therebetween. On the other hand, a conductor foil 1 is provided on the upper surface of the thick adhesive film 21 and, further, a pressing sheet 4 with a protrusion 41 which is made to protrude so as to be mated with the inside of the through-hole is placed on the conductor foil 1 and heat and a pressure are applied to them. By this process, the thick adhesive film 21 and the thin adhesive film 22 are cured to form an insulating board 2 and, at the same time, the conductor foil 1 is bonded to the upper surface of the insulating board 2 and the core board 5 is bonded to the lower surface of the insulating board 2 and unified with each other to obtain a multilayer board. Further, by mating the protrusion with the inside of the through-hole, a mounting recess is formed in the insulating board 2 and the conductor foil 1 is tightly bonded to the inside of the mounting recess. |
| format | Patent |
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A core board 5 is provided under the thick adhesive film 21 with a thin adhesive film 22 covering the through-hole therebetween. On the other hand, a conductor foil 1 is provided on the upper surface of the thick adhesive film 21 and, further, a pressing sheet 4 with a protrusion 41 which is made to protrude so as to be mated with the inside of the through-hole is placed on the conductor foil 1 and heat and a pressure are applied to them. By this process, the thick adhesive film 21 and the thin adhesive film 22 are cured to form an insulating board 2 and, at the same time, the conductor foil 1 is bonded to the upper surface of the insulating board 2 and the core board 5 is bonded to the lower surface of the insulating board 2 and unified with each other to obtain a multilayer board. Further, by mating the protrusion with the inside of the through-hole, a mounting recess is formed in the insulating board 2 and the conductor foil 1 is tightly bonded to the inside of the mounting recess.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980410&DB=EPODOC&CC=JP&NR=H1092971A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980410&DB=EPODOC&CC=JP&NR=H1092971A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKADA MASATOME</creatorcontrib><creatorcontrib>TSUKADA KIYOTAKA</creatorcontrib><title>MANUFACTURE OF ELECTRONIC COMPONENT MOUNTING BOARD</title><description>PROBLEM TO BE SOLVED: To simplify the manufacturing process. SOLUTION: A through-hole is formed in a thick adhesive film 21. A core board 5 is provided under the thick adhesive film 21 with a thin adhesive film 22 covering the through-hole therebetween. On the other hand, a conductor foil 1 is provided on the upper surface of the thick adhesive film 21 and, further, a pressing sheet 4 with a protrusion 41 which is made to protrude so as to be mated with the inside of the through-hole is placed on the conductor foil 1 and heat and a pressure are applied to them. By this process, the thick adhesive film 21 and the thin adhesive film 22 are cured to form an insulating board 2 and, at the same time, the conductor foil 1 is bonded to the upper surface of the insulating board 2 and the core board 5 is bonded to the lower surface of the insulating board 2 and unified with each other to obtain a multilayer board. Further, by mating the protrusion with the inside of the through-hole, a mounting recess is formed in the insulating board 2 and the conductor foil 1 is tightly bonded to the inside of the mounting recess.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDydfQLdXN0DgkNclXwd1Nw9XF1Dgny9_N0VnD29w3w93P1C1Hw9Q_1C_H0c1dw8ncMcuFhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR6GBpZGluaGjsZEKAEASS8m1w</recordid><startdate>19980410</startdate><enddate>19980410</enddate><creator>TAKADA MASATOME</creator><creator>TSUKADA KIYOTAKA</creator><scope>EVB</scope></search><sort><creationdate>19980410</creationdate><title>MANUFACTURE OF ELECTRONIC COMPONENT MOUNTING BOARD</title><author>TAKADA MASATOME ; TSUKADA KIYOTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH1092971A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKADA MASATOME</creatorcontrib><creatorcontrib>TSUKADA KIYOTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKADA MASATOME</au><au>TSUKADA KIYOTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF ELECTRONIC COMPONENT MOUNTING BOARD</title><date>1998-04-10</date><risdate>1998</risdate><abstract>PROBLEM TO BE SOLVED: To simplify the manufacturing process. SOLUTION: A through-hole is formed in a thick adhesive film 21. A core board 5 is provided under the thick adhesive film 21 with a thin adhesive film 22 covering the through-hole therebetween. On the other hand, a conductor foil 1 is provided on the upper surface of the thick adhesive film 21 and, further, a pressing sheet 4 with a protrusion 41 which is made to protrude so as to be mated with the inside of the through-hole is placed on the conductor foil 1 and heat and a pressure are applied to them. By this process, the thick adhesive film 21 and the thin adhesive film 22 are cured to form an insulating board 2 and, at the same time, the conductor foil 1 is bonded to the upper surface of the insulating board 2 and the core board 5 is bonded to the lower surface of the insulating board 2 and unified with each other to obtain a multilayer board. Further, by mating the protrusion with the inside of the through-hole, a mounting recess is formed in the insulating board 2 and the conductor foil 1 is tightly bonded to the inside of the mounting recess.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | MANUFACTURE OF ELECTRONIC COMPONENT MOUNTING BOARD |
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