MANUFACTURE OF ELECTRONIC COMPONENT MOUNTING BOARD

PROBLEM TO BE SOLVED: To simplify the manufacturing process. SOLUTION: A through-hole is formed in a thick adhesive film 21. A core board 5 is provided under the thick adhesive film 21 with a thin adhesive film 22 covering the through-hole therebetween. On the other hand, a conductor foil 1 is provided on the upper surface of the thick adhesive film 21 and, further, a pressing sheet 4 with a protrusion 41 which is made to protrude so as to be mated with the inside of the through-hole is placed on the conductor foil 1 and heat and a pressure are applied to them. By this process, the thick adhesive film 21 and the thin adhesive film 22 are cured to form an insulating board 2 and, at the same time, the conductor foil 1 is bonded to the upper surface of the insulating board 2 and the core board 5 is bonded to the lower surface of the insulating board 2 and unified with each other to obtain a multilayer board. Further, by mating the protrusion with the inside of the through-hole, a mounting recess is formed in the insulating board 2 and the conductor foil 1 is tightly bonded to the inside of the mounting recess.