ORIGINAL PLATE FOR PLATING, FORMATION OF METALLIC THIN FILM USING THE SAME AS WELL AS PRODUCTION OF ORIGINAL PLATE FOR PLATING

PROBLEM TO BE SOLVED: To provide a method for forming metallic thin films of a multistage shape by plating which is short in stages and is advantageous in productivity and by which an improvement in yield is expected, and an original plate for plating used for the same and to simultaneously provide a process for producing the original plate. SOLUTION: The original plate for forming the metallic thin films of the multistage shape by plating has a conductive substrate 110, insulating parts 120 which are embedded in the recessed parts formed on the surface part of this conductive substrate 110 and consists of insulative materials having their exposed parts flush with the surface of the conductive substrate 110 and electrically isolated conductive parts which are embedded in the recessed parts formed on the surface parts of these insulating parts, are electrically insulated from the conductive substrate by the insulating parts and consists of conductive materials having their exposed parts flush with the surface of the conductive substrate. The width of the insulating parts on the surface of the conductive substrate adjacent to the isolated conductive parts is so determined as to allow the regulation of the time until the plating parts deposited on the surface of the conductive substrate after the start of plating, when the plating is executed with the original plate as cathode, grow in the direction along the surface of the conductive plate as well, ride over the insulating parts and arrive at the adjacent conductive parts to electrically connect the conductive parts and the conductive substrate.