LEAD FRAME AND SEMICONDUCTOR DEVICE USING NON-OHMIC MATERIAL

PROBLEM TO BE SOLVED: To improve abnormal-voltage inner-voltage characteristic and reliability by using non-ohmic material in a process for packaging or chip manufacture, so as to block the inflow of abnormal pulse such as an abnormal voltage or a surge voltage into a semiconductor chip. SOLUTION: I...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIN NANKO, CHO DAIKO, KO KIGEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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